Texas Instruments Incorporated (TI) recently introduced diversity mixed
signal receive processor for 3G base stations and fixed wireless communication
devices. TI's AFE8406 multi-carrier chip integrates a dual 14 bit 85 MSPS (mega
samples per second) analog-to-digital converter (ADC) and sixteen channels of
programmable digital down conversion (DDC) into a single device.
Leveraging TI's high performance, advanced technology, this multi-channel
communication signal processor offers increased density, resulting in lower
costs for systems supporting a range of 3G standards. The multiple DDC channels
allow a larger number of carriers per signal chain, translating to significantly
reduced implementation costs. TI's AFE8406 can be configured to support up to
four-carrier UMTS, eight-carrier CDMA or eight-carrier TD-SCDMA diversity
receivers.
"The release of the 3G spectrum in China will create a large demand for
advanced wireless infrastructure applications, providing the next-level of
mobile telecommunications services and features to the world's largest cellular
market," said David Briggs, TI's analog wireless infrastructure business
manager. "TI has responded to the wireless infrastructure designers' needs
for enhanced integration, higher performance and increased density for 3G
applications with its new AFE8406."
At an input frequency of 140 MHz, the device delivers signal-to-noise ratio (SNR)
of greater than 68 dB, and spurious free dynamic range (SFDR) of greater than 70
dBc. The AFE8406 continues to build on TI's existing portfolio of
state-of-the-art signal chain solutions:
GC5018, an eight channel wide band down converter with front end/back end AGC;
GC5016, a four channel digital down/up converter. GC1115, crest factor reduction
processors. ADS5411-11bit 105MSPS and ADS5545, high speed analog-to-digital
converters, 14 bit 170MSPS. DAC5687, a dual 16 bit 500MSPS, high-speed
digital-to-analog converters. TRF3761 frequency synthesizer and TRF3702 RF
quadrature modulator.
For developers using the AFE8406, TI provides an evaluation module (EVM) for
easy integration of the device into wireless infrastructure base stations and
other targeted applications. The EVM is complemented with the easy to use GC
Studio software for data analysis.
The AFE8406 is available in a 484-pin 23 mm x 23 mm ball grid array (BGA)
package. Samples are available now with projected production in 1Q 2006. For
more information on this product and TI's complete portfolio of wireless
infrastructure solutions, visit www.ti.com/afe.
