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    Wavesat Introduces Small BGA package for WiMAX chip


Wavesat has recently announced a 208 pin BGA (ball grid array) package option for its Evolutive™ WiMAX DM256 Family of Products. According to the Company press release, it is the smallest package currently available for 802.16-2004 compliant chips. The DM256 BGA package significantly reduces area size, providing OEM’s & ODM’s with an ideal WiMAX tool for small form-factor applications.

The small (15mm x 15mm) DM256 BGA package offers the same low power consumption as the Plastic Quad Flat Pack (PQFP), but reduces the circuit board footprint significantly.. The DM256 BGA packaging is designed for a wide variety of power and space constrained WiMAX applications that require modular, small size and high reliability form-factors, such as mini-PCI and PCMCIA.

“With the smallest footprint in the marketplace, the DM256 BGA package sets the stage for our customers to offer next generation WiMAX solutions using mini-PCI and PCMCIA formats,“ said Vijay Dube, VP Marketing and Business Development. “These compact platforms will lead the way to low cost subscriber units by offering flexibility, reducing NRE costs and shortening time to market.“

About the Evolutive™ WiMAX DM256 Family of Products

Wavesat’s Evolutive™ WiMAX DM256 Family of Products consist of a full-range of standard-based integrated circuits, software and reference kits for the most demanding BWA 802.16 compliant applications requiring flexible product and network configurations. The Evolutive™ WiMAX family of products is a complete and cost-effective solution supporting all the necessary features to design base stations and subscriber units for both licensed and license-exempt radio frequencies.

For more info contact Isabelle Pilon, ipilon@wavesat.com

    Submitted By: rfdesign.info news team Date: 2005-07-09
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